integrated circuit packaging density

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• Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… …   Wikipedia

• Integrated circuit design — Layout view of a simple CMOS Operational Amplifier ( inputs are to the left and the compensation capacitor is to the right ). The metal layers are colored blue and green, the polysilicon is red and vias are crosses. Integrated circuit design, or… …   Wikipedia

• Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… …   Wikipedia

• Application-specific integrated circuit — An application specific integrated circuit (ASIC) is an integrated circuit (IC) customized for a particular use, rather than intended for general purpose use. For example, a chip designed solely to run a cell phone is an ASIC.In contrast, the… …   Wikipedia

• Printed circuit board — Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through hole paths to the other surface), and some mounted electrical components A printed circuit board, or PCB, is used to… …   Wikipedia

• Semiconductor device fabrication — Semiconductor manufacturing processes 10 µm 1971 3 µm 1975 1.5 µm 1982 …   Wikipedia

• DIP — may refer to: Contents 1 As a three letter acronym 1.1 In science and technology 1.1.1 In computer scie …   Wikipedia

• Package on package — (PoP) is an integrated circuit packaging technique to allow vertically combining discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed on top of one another, i.e. stacked, with a standard interface to route… …   Wikipedia

• materials science — the study of the characteristics and uses of various materials, as glass, plastics, and metals. [1960 65] * * * Study of the properties of solid materials and how those properties are determined by the material s composition and structure, both… …   Universalium

• Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents …   Wikipedia

• IBM Solid Logic Technology — Solid Logic Technology (SLT) was IBM s method for packaging electronic circuitry introduced in 1964 with the IBM System/360 series and related machines. IBM chose to design custom hybrid circuits using discrete, flip chip mounted, glass… …   Wikipedia